COMe bIP2

COMe bIP2 is a COMe Basic modules with a 125x95 mm footprint and pin-out types 2

Spec Description
Technology Intel x86
Formfactor COM Express Basic
CPU
  • Intel® Core™ i3-3120ME (dual-core, 2.4GHz),
  • Intel® Core™ i3-3217UE (dual-core, 1.6GHz),
  • Intel® Core™ i5-3610ME (dual-core, 2.7GHz),
  • Intel® Core™ i7-3517UE (dual-core, 1.7GHz),
  • Intel® Core™ i7-3555LE (dual-core, 2.5GHz),
  • Intel® Core™ i7-3612QE (quad-core, 2.1GHz),
  • Intel® Core™ i7-3615QE (quad-core, 2.3GHz),
  • Intel® Celeron® 1020E (dual-core, 2.2GHz),
  • Intel® Celeron® 1047UE (dual-core, 1.4GHz),
  • Intel® Celeron® 927UE (single-core, 1.5GHz)
Chipset Intel 7-Series Platform Controller Hub
RAM up to 16GB DDR3 (1066/1333), 2x 204 pin SO-DIMM, dual channel
Flash SSD optional
Storage Interfaces
  • 4x SATA 3Gb/s;
  • 1x Enhanced IDE (UDMA6, 133MB/s)
USB 8 x USB 2.0
Bus Interfaces
  • 5x PCI Express x1,
  • 1x PCI Express Graphics (PEG) x16,
  • PCI Bus, 32bit, 33 MHz,
  • LPC bus (Low Pin Count bus)
Display Controller Intel HD Graphics 4000
Display Memory UMA, up to 384MB
Display Interfaces
  • Analog up to 2048x1536,
  • SDVO interface, single channel muxed with PEG signals,
  • LVDS 18/24 bit, dual channel, resolution up to 1920 x 1200
  • 3x Display Port/HDMI interfaces, muxed with PEG, up to 2560x1600
Network Interface 10/100/1000Base-TX
Audio Interface High Definition Audio
Security Device TPM 1.2
Miscellaneous
  • Watchdog Timer:
  • Initiates system reset, programmable
  • Fan Supply:
  • 4-pin header (12V), PWM speed control,
  • RTC battery: external
  • System Monitoring:
  • voltage, temperature, CPU fan
Feature Highlights
  • Type 2 pin-out
  • DP/HDMI multiplexing
Firmware AMI Aptio UEFI
OS Support
  • Windows 7 (embedded)
  • BSP for Windows XP (embedded)
  • BSP for Linux on request
  • EAPI (HW Programming Interface)
Power Requirement +12V+/-10%, 5V Stby optional, 25 W (typ.) up to 65 W (typ.)
Environment Ambient Temperature
Dimensions 125mm x 95mm
Certificates UL / CE
Cooling
  • Passive heat sink
  • Active heat sink with fan
  • Heat spreader with threaded or non-threaded standoffs
Carrier
  • Carrier board in MiniITX form factor;
  • Evaluation board
Memory DDR3 SODIMMS 1GB, 2GB or 4GB