Samsung has announced the mass production of the industry’s thinnest LPDDR5X memory modules, available in 12GB and 16GB capacities. The new design reduces the package thickness to just 0.65mm—about 9% thinner than standard LPDDR5X packaging.
This breakthrough is expected to power the next generation of ultra-thin smartphones, while also delivering better airflow and improved performance through superior heat management.
How Samsung Achieved the Thinnest LPDDR5X Packaging #
According to Samsung’s press release, the company reached this milestone by introducing new packaging methods such as:
- Optimized PCB layout
- Improved EMC design
- An advanced back-coating process to further reduce overall height
The result is a dramatic reduction in thickness combined with a 21.2% boost in heat resistance compared to previous models.
Why Thinner Packaging Matters for Smartphones #
The benefits of thinner LPDDR5X packaging extend far beyond compact form factors:
- Better airflow inside smartphones → improved thermal management
- Higher sustained performance → prevents thermal throttling
- Longer battery life → efficient power and heat handling
- Extended device lifespan → reduced thermal stress over time
YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics, emphasized:
“LPDDR5X DRAM not only delivers exceptional performance but also introduces advanced thermal management in an ultra-compact package. This sets a new standard for AI-driven high-performance devices. We remain committed to innovation, working closely with customers to address the evolving needs of the low-power DRAM market.”
Beyond Thinner Memory: A Holistic Smartphone Design #
While Samsung’s thinner LPDDR5X contributes to slimmer devices, it’s just one piece of the puzzle. Other smartphone components, such as ultra-thin protective glass, compact PCBs, and slimmer batteries, are equally important in reducing overall device thickness.
In fact, the biggest advantage of the new memory modules may be the si